influence of fixed abrasive configuration on the polishing

influence of fixed abrasive configuration on the polishing

Influence of fixed abrasive configuration on the polishing

Lapping and polishing with fixed abrasives is an efficient method to flatten wafers and obtain mirror surface finish. One of the most concerned things is abrasive configuration for polishing pads in research. Researching on pad’s abrasive configuration will help get better wafer surface quality.

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characteristic of fixed abrasive polishing for fused silica

Characteristic of fixed abrasive polishing for fused silica

In order to overcome the shortcomings of the traditional free abrasive polishing method, hence some institutes and organizations have turned to fixed abrasive polishing. Professor Stephen D. Jacobs of the University of Rochester in the United States developed a cerium oxide fixed abrasive polishing technique, which could reduce the roughness

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influence of different acid and alkaline slurry on fixed

Influence of different acid and alkaline slurry on fixed

The abrasive-free acid slurry with citric acid at pH 5.0 is effective for fixed abrasive CMP of LBO crystal, obtaining a MRR of 366 nm/min and fine surface quality with surface roughness Sa 0.32

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development of fixed abrasive chemical mechanical polishing

Development of fixed abrasive chemical mechanical polishing

Fixed abrasive pad (FAP) plays an important role in fixed abrasive polishing process, and its self-conditioning has an important influence on machining stability and processing efficiency in micro

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influence of polishing and pressing force on the material

Influence of Polishing and Pressing Force on the Material

To help reduce the environmental impact of abrasive polishing, we have investigated the use of a compact robot and fixed-abrasive polishing. We used a five-joint closed-link compact robot with a fine diamond stone on its main axis to polish the glass plate and measured the polishing pressure(=pressing force/stone constant area), the polishing force, and the material removal rate.

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characteristic of fixed abrasive polishing for fused silica

Characteristic of fixed abrasive polishing for fused silica

In order to overcome the randomness of free abrasive polishing (CMP), abrasive waste and the resulting hydration layer, this paper presents a fixed abrasive polishing technique in the anhydrous environment. We have achieved a stable polishing wheel sintering process. The pellet we made have applied to fused silica polishing.

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analysis of path distribution in lapping and polishing with

Analysis of Path Distribution in Lapping and Polishing with

The path distribution can directly affect the machined workpiece surface quality in lapping and polishing, such as planeness, roughness, etc. In present paper, the influence of rotate speed ratio (RSR) and abrasive position on path distribution was analyzed with a single fixed abrasive.

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fixed abrasive design for chemical mechanical polishing

Fixed Abrasive Design for Chemical Mechanical Polishing

Content Micro-Fabrication Techniques for Fixed Abrasive for Chemical Mechanical Polishing (CMP) Control of Abrasive Shape Construction of Micro-Scale Wear Mode Diagram Standard Fabrication Process Lift-Off Technique 2002 and 2003 Goals First SFR Annual Review Y. Moon, K. Bevans, and D. A. Dornfeld Fixed Abrasive Design for Chemical Mechanical

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[pdf] the effect of mixed abrasive slurry on cmp of 6h-sic

[PDF] The Effect of Mixed Abrasive Slurry on CMP of 6H-SiC

In this paper, the material removal rate (MRR) is investigated to recognize how long the CMP process continues to remove a damaged layer by mechanical polishing using 100 nm sized diamond, and the authors tried to find the dependency of mechanical factors such as pressure, velocity and abrasive concentration using single abrasive slurry (SAS).

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characteristics of abrasive-free micelle slurry for copper

Characteristics of Abrasive-Free Micelle Slurry for Copper

The influence of polishing pressure and platen speed on the polishing rate with the micelle slurry and with the commercial abrasive-particle slurry, as found in the wafer polishing experiments using the hard pad, is shown in Fig. 6 and 7. With the conventional slurry, the use of the hard pad generally resulted in low polishing rates, presumably

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material removal mechanisms in abrasive vibration polishing

Material removal mechanisms in abrasive vibration polishing

The specific influence factors of vibration polishing were analyzed and will be presented. The determination of material removal behavior and polishing effect on planar steel samples has shown that the conventional abrasive polishing hypothesis of Preston is applicable to the novel vibration polishing process.

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metallographic grinding and polishing insight | struers.com

Metallographic grinding and polishing insight | Struers.com

The polishing cloths have a strong influence on the planeness of the samples. A polishing cloth with low resilience produces samples with less relief than a cloth with high resilience. See Edge Rounding for the correct way to change preparation parameters. To avoid relief with layers and coatings, mounting may help to improve the result.

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the effect of abrasive hardness on the chemical-assisted

The effect of abrasive hardness on the chemical-assisted

A series of abrasives with various hardness values including monocrystalline and polycrystalline diamond, α- and γ-alumina, zirconia, ceria, and silica were used to examine the concept of chemical-assisted polishing for finishing the (0001), c-plane (basal plane), of sapphire.

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generation of scratches and their effects on laser damage

Generation of Scratches and Their Effects on Laser Damage

Abrasive sizes of polishing compounds were examined with a particle size analyzer (Mastersizer 3000, Malvern, UK). The morphology of the abrasives was inspected with a scanning electron microscope

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analysis of slurry flow in chemical-mechanical polishing

Analysis of Slurry Flow in Chemical-Mechanical Polishing

Once in the polishing interface, the abrasives start removing material by plowing and/or cutting. Figure la is a schematic of the rotary type CMP machine. Of course, other ways of fulfilling the basic polishing requirements are possible as are depicted in Figure 11. Typically, linear and orbital polishing machines are more

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machines, devices, or processes for grinding or polishing

MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING

Grinding Grinding means machining by fixed abrasive particles in its most general sense and covers "corrective" operations, such as correction of dimension, e.g. diameter, or shape, e.g. roundness. It is characterised by a comparatively high material removal rate. Polishing Polishing means mechanically finishing the surface of a work so as

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the effect of abrasive hardness on the chemical-assisted

The effect of abrasive hardness on the chemical-assisted

A series of abrasives with various hardness values including monocrystalline and polycrystalline diamond, α- and γ-alumina, zirconia, ceria, and silica were used to examine the concept of chemical-assisted polishing for finishing the (0001), c-plane (basal plane), of sapphire.

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a novel approach of chemical mechanical polishing using

A novel approach of chemical mechanical polishing using

A novel approach of chemical mechanical polishing (CMP) is developed for mercury cadmium telluride (HgCdTe or MCT) semiconductors. Firstly, fixed-abrasive lapping is used to machine the MCT wafers

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analysis of slurry flow in chemical-mechanical polishing

Analysis of Slurry Flow in Chemical-Mechanical Polishing

Once in the polishing interface, the abrasives start removing material by plowing and/or cutting. Figure la is a schematic of the rotary type CMP machine. Of course, other ways of fulfilling the basic polishing requirements are possible as are depicted in Figure 11. Typically, linear and orbital polishing machines are more

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generation of scratches and their effects on laser damage

Generation of Scratches and Their Effects on Laser Damage

Abrasive sizes of polishing compounds were examined with a particle size analyzer (Mastersizer 3000, Malvern, UK). The morphology of the abrasives was inspected with a scanning electron microscope

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[pdf] effect of chemical additive on fixed abrasive polishing

[PDF] Effect of Chemical Additive on Fixed Abrasive Polishing

Non-water based fixed abrasive polishing was adopted to manufacture LBO crystal for nano precision surface quality because of its deliquescent. Ethyl alcohol was selected as the non-water based slurry solvent and ethanediamine, lactic acid, hydrogen peroxide was added in the slurry as a chemical additive, respectively. Effect of different additives with non-water based slurry on material

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development of fixed abrasive chemical mechanical polishing

Development of fixed abrasive chemical mechanical polishing

Glass disk substrates are used in a wide range of portable devices because of their relatively high resistance to heat and shocks compared to aluminum substrates.

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machines, devices, or processes for grinding or polishing

MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING

Grinding Grinding means machining by fixed abrasive particles in its most general sense and covers "corrective" operations, such as correction of dimension, e.g. diameter, or shape, e.g. roundness. It is characterised by a comparatively high material removal rate. Polishing Polishing means mechanically finishing the surface of a work so as

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modeling of chemical mechanical polishing using fixed

Modeling of chemical mechanical polishing using fixed

Chemical Mechanical Polishing (CMP) is conventionally carried out using abrasive slurry and a polishing pad. An alternative process is the "fixed abrasive" polish. Existing models, which accurately predict oxide thickness variations across a chip for the conventional CMP process, have not previously been tested for the fixed abrasive process. In this study wafers were polished using the fixed

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machines, devices, or processes for grinding or polishing

MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING

Grinding Grinding means machining by fixed abrasive particles in its most general sense and covers "corrective" operations, such as correction of dimension, e.g. diameter, or shape, e.g. roundness. It is characterised by a comparatively high material removal rate. Polishing Polishing means mechanically finishing the surface of a work so as

Get Price
[pdf] effect of chemical additive on fixed abrasive polishing

[PDF] Effect of Chemical Additive on Fixed Abrasive Polishing

Non-water based fixed abrasive polishing was adopted to manufacture LBO crystal for nano precision surface quality because of its deliquescent. Ethyl alcohol was selected as the non-water based slurry solvent and ethanediamine, lactic acid, hydrogen peroxide was added in the slurry as a chemical additive, respectively. Effect of different additives with non-water based slurry on material

Get Price
hybrid polishing of fused silica glass with bound-abrasive

Hybrid polishing of fused silica glass with bound-abrasive

We incorporated ultrasonic vibration into recently developed fixed-abrasive pellets in an attempt to enhance MRR and/or to improve manufactured surface quality. A prototype ultrasonic vibrator, the heart of the polishing head, was designed and the related experimental work was performed on an in-house built setup in conjunction with the

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grinding | tokyo diamond tools mfg. co., ltd.

Grinding | Tokyo Diamond Tools Mfg. Co., Ltd.

“Chemex” resin bond wheel realizing fixed abrasive in silicon wafer polishing “Chemex” wheel uses chemical action together with mechanical action to realize fixed abrasive polishing instead of conventional loose abrasive polishing. The target is to achieve high-quality surface like slurry.

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study on vibration characteristics of polishing rod

Study on Vibration Characteristics of Polishing Rod

The vibration of grinding tools is very essential to the performance of parts and the safety of machine tools. However, the vibrationis rarely studied in the process of polishing aeroengine blade with abrasive cloth wheel. Polishing force is measured by dynamometer in the process of polishing aeroengine blade with abrasive cloth wheel, and the time-domain expressions of polishing force are

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international journal of abrasive technology (ijat

International Journal of Abrasive Technology (IJAT

International Journal of Abrasive Technology; Forthcoming articles; Forthcoming articles International Journal of Abrasive Technology. These articles have been peer-reviewed and accepted for publication but are pending final changes, are not yet published and may not appear here in their final order of publication until they are assigned to issues.

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finishing and polishing materials - linkedin slideshare

Finishing and polishing materials - LinkedIn SlideShare

Abrasive discs : • Gross reduction, contouring, finishing, and polishing of restoration surfaces • Coated with aluminum oxide abrasive Abrasive strips : • With plastic or metal backing are available for smoothening and polishing the interproximal surfaces of direct and indirect bonded restorations 49

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modeling of chemical mechanical polishing using fixed

Modeling of chemical mechanical polishing using fixed

Chemical Mechanical Polishing (CMP) is conventionally carried out using abrasive slurry and a polishing pad. An alternative process is the "fixed abrasive" polish. Existing models, which accurately predict oxide thickness variations across a chip for the conventional CMP process, have not previously been tested for the fixed abrasive process. In this study wafers were polished using the fixed

Get Price